Selecting subgrids from a spatial monitoring network: Proposal and application in semiconductor manufactoring process

Diego Zappa, Riccardo Borgoni

Risultato della ricerca: Contributo in rivistaArticolo in rivistapeer review

2 Citazioni (Scopus)

Abstract

The monitoring of spatial production processes typically involves sampling network to gather information about the status of the process. Sampling costs are often not marginal, and once the process has been accurately calibrated, it might be appropriate to reduce the dimension of the sampling grid. This aim is often achieved through the allocation of a brand new network of less dimension. In some cases that is not possible and it might be necessary the selection of a subgrid extracted from the original network. Motivated by a real semiconductor problem, we propose a method to extract a monitoring subgrid from a given one, based upon grid representativeness, accuracy, and spatial coverage of the subgrid and, if available, by expert knowledge of the weights to be assigned to those areas where production may need greater precision. Discussion is mainly focused on circular spatial domain, since, in microelectronics, the basic production support, called wafer, is a circle. Straightforward generalizations to different spatial domains are possible. Furthermore, conditionally upon the availability of experimental data, we check the loss of accuracy by fitting a dual mean-variance response surface on the reduced grid. Joining the latter information and the criteria used to select the subgrid, we provide additional guidelines on how to fine-tune the subgrid selection. Real case studies are used to show the effectiveness of the proposal.
Lingua originaleEnglish
pagine (da-a)1249-1261
Numero di pagine13
RivistaQuality and Reliability Engineering International
Volume2017 vol. 33
DOI
Stato di pubblicazionePubblicato - 2017

Keywords

  • dual response surface models, monitoring networks, statistics for microelectronics

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