Response surface prediction from a spatial montoring process

Riccardo Borgoni, Luigi Radaelli, Diego Zappa

Risultato della ricerca: Contributo in libroChapter


We present an approach that selects a sub-grid from an in monitoring map according to the criterion of spatial optimal coverage of the wafer surface (see also Walvoort, 2010). This approach may also include expert knowledge about those areas where production is less precise because of unavoidable technical reasons and hence may indicate where a higher sampling density must be assured. If sampling measures are available, a validation procedure can be used to select the best sub-map based for instance on the prediction error, by comparing the results obtained using the full and the reduced grid.
Lingua originaleEnglish
Titolo della pubblicazione ospiteBook of abstracts
Numero di pagine2
Stato di pubblicazionePubblicato - 2013

Serie di pubblicazioni

NomeQuaderni di dipartimento


  • Kriging
  • statistics for microelectronics


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