Optimal reduction of a spatial monitoring grid: Proposals and applications in process control

Diego Zappa, Riccardo Borgoni, Luigi Radaelli, Valeria Tritto

Risultato della ricerca: Contributo in rivistaArticolo in rivistapeer review

7 Citazioni (Scopus)

Abstract

Deposition of silicon dioxide (SiO2) is a critical step of integrated circuit manufacturing; hence it is monitored during the manufacturing process at a grid of points defined on the wafer area. Since collecting thickness measurements is expensive, it is a compelling issue to investigate how a sub grid can be identified. A strategy based on spatial prediction and simulating annealing is proposed to tackle the problem which proved to be effective when applied to a real process. A diagnostic device for monitoring the deposition process is also discussed which can be usefully adopted in the day-to-day activity by practitioners acting in process control of a microelectronics fab.
Lingua originaleEnglish
pagine (da-a)407-419
Numero di pagine13
RivistaCOMPUTATIONAL STATISTICS & DATA ANALYSIS
Volume58
DOI
Stato di pubblicazionePubblicato - 2013

Keywords

  • Kriging
  • Simulated annealing
  • Spatial sampling
  • Statistics for microelectronics

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