WIPO (World Intellectual Property Organization)
Method and system for facilitating the determination of the end-point in plasma etching process

Diego Zappa; Giuseppe Fazio; Roberto Colombo

WIPO (World Intellectual Property Organization) Method and system for facilitating the determination of the end-point in plasma etching process

Diego Zappa (Inventor), Giuseppe Fazio (Inventor), Roberto Colombo (Inventor)

Research output: Patent

Original language	English
Patent number	2006/106556 A1
Publication status	Published - 12 Oct 2006

Keywords

Microelettronics
Plasma etch process
Quality control

Cite this

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title = "WIPO (World Intellectual Property Organization) Method and system for facilitating the determination of the end-point in plasma etching process",

keywords = "Microelettronics, Plasma etch process, Quality control, Microelettronics, Plasma etch process, Quality control",

author = "Diego Zappa and Giuseppe Fazio and Roberto Colombo",

year = "2006",

month = oct,

day = "12",

language = "English",

type = "Patent",

note = "2006/106556 A1",

}

TY - PAT

T1 - WIPO (World Intellectual Property Organization) Method and system for facilitating the determination of the end-point in plasma etching process

AU - Zappa, Diego

AU - Fazio, Giuseppe

AU - Colombo, Roberto

PY - 2006/10/12

Y1 - 2006/10/12

KW - Microelettronics

KW - Plasma etch process

KW - Quality control

KW - Microelettronics

KW - Plasma etch process

KW - Quality control

UR - http://hdl.handle.net/10807/15462

M3 - Patent

M1 - 2006/106556 A1

ER -

WIPO (World Intellectual Property Organization) Method and system for facilitating the determination of the end-point in plasma etching process

Keywords

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