Response surface prediction from a spatial montoring process

Diego Zappa, Riccardo Borgoni, Luigi Radaelli

Research output: Chapter in Book/Report/Conference proceedingChapter


We present an approach that selects a sub-grid from an in monitoring map according to the criterion of spatial optimal coverage of the wafer surface (see also Walvoort, 2010). This approach may also include expert knowledge about those areas where production is less precise because of unavoidable technical reasons and hence may indicate where a higher sampling density must be assured. If sampling measures are available, a validation procedure can be used to select the best sub-map based for instance on the prediction error, by comparing the results obtained using the full and the reduced grid.
Original languageEnglish
Title of host publicationBook of abstracts
Number of pages2
Publication statusPublished - 2013

Publication series

NameQuaderni di dipartimento


  • Kriging
  • statistics for microelectronics


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